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PhytoTechnology Laboratories

Keiki Paste
Product ID: K424

Introduction

Description: Keiki Paste; Contains Lanolin, trans-Cinnamic Acid, myo-Inositol, 6-Benzylaminopurine, Thiamine HCl, and Adenine Hemisulfate.

Physical Form Solid
Storage Temp. Room Temperature
UPC / SKU K424
Manufactured from L451, C283, I703, B800, T390, A545
Storage Temp. Room Temperature
Tariff Code 3808.30.0000
Risk Info (R) 36/37/38
Safety Info (S) 36
No information available

K424 Keiki Paste

Synonyms: Contains Lanolin, trans-Cinnamic Acid, myo-Inositol, 6-Benzylaminopurine, Thiamine HCl, and Adenine Hemisulfate
CAS: N/A
Formula: N/A
Mol. Weight: N/A
Properties
Form: Solid
Appearance: Yellow Greasy Paste
Application: In Vivo Orchid Multiplication
Solubility: Emulsifies in approximately 3 parts Water
Storage Temp: Room Temperature
Typical Working Concentration: As is (Neat)
Other Notes: The formulation (specific amount of each component) is proprietary

Application Notes
Keiki paste is spread on the node of an orchid inflorescence to induce growth of a clone of the mother plant.

General procedures for inducing clone are as followed:
1. Carefully remove the bract of the flower stalk with a wooden toothpick. Nodes that are closer to the base have higher chance of inducing a plantlet.
2. Apply a small amount of keiki paste with a toothpick onto the exposed bud. Reapply after two weeks if there is no visible sign of growth.
3. Swelling of the bud will occur after a few days. After several weeks, leaves will appear.
4. Plantlet may be removed from the stalk when a healthy leaves and roots have developed.

Please note: Effectiveness depends upon plant species. Some plant species induced one or more plantlets with keiki paste faster and easier than others.

References